Products
Cluster Sputtering System

The OSCC-8000 is a cluster-type sputtering/etching system. It supports wafers up to φ200 mm in diameter, has up to five process chambers, and is optimally designed for film deposition of BAW/SAW filters and back electrodes for power devices.

Features

  • The TC chamber is equipped with an aligner and a cooling stage.
  • Soft etching chamber can be installed.
  • The deposition chamber can be equipped with an RF bias mechanism and a substrate heating mechanism.
  • ESC can be installed to accommodate wafer thinning.
OCSS Cluster sputtering system

Application fields

  • 電子デバイス（通信デバイス(BAW/SAW)）

    Electronic devices
    (Communication devices (BAW/SAW))

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