Products
OGCT　Gas cluster trimming system

Gas Cluster Ion Beam Trimming System
Ideal for controlling film thickness during RF filter frequency tuning, accommodates wafers up to Φ200mm, and achieves yield improvement through high-precision thickness trimming control.

Features

  • Equipped with EFEM, cassette-to-cassette specification
  • Acceleration energy: Up to 60kV
  • Calculates optimal etching amount using proprietary simulation software
  • High-precision etching control via high-accuracy scanning system
  • Optional optical film thickness measurement device available
OGCT Gas Cluster Ion Trimming System

Application fields

  • 電子デバイス（通信デバイス(BAW/SAW)）

    Electronic devices
    (Communication devices (BAW/SAW))

  • 半導体

    Semiconductor

Specification

OGCT-8000
Dimension L5035×W1971×H2302
Gas Cluster Ion Beam Source Electron impact type,
adiabatic expansion cluster type
Film Thickness Measurement Unit FTMW-200P,
reflective micro-spectroscopic type
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