ProductsOWLE Lift-off Evaporation system
Inter-back type vapor deposition apparatus capable of continuous film deposition under high vacuum
With its excellent film thickness distribution and direct-injection capability, it is suitable for lift-off deposition in electronic devices and mass production of optical thin films.
Features
- Process multiple wafers at once
- Excellent film deposition directability
- Large capacity and multi-point hearth
- Additional process rooms are available as an option.
Application fields
-
Head-mounted display /
Smart glasses -
Electronic devices
(Communication devices (BAW/SAW))
Specification
| OWLE-1950 | |
| Vacuum Chamber | D2100mm ×H2060mm(PC) |
| Substrate Dome Size | φ1950mm |
| Evaporation Source | EB Souce: 2 Unit |
| Ion Source | RF Ion Source |
| Crystal Film Thickness Monitor | 18-point Crystal film monitor |
| Optical Film Thickness Control System | DHOM-4T Wavelength range: 350nm~2400nm Transmittance |
| OWLE-1100S | OWLE-1100 | |||
| Wafer size | 6-inch | 8-inch | 4-inch | 6-inch |
| Number of wafers loaded | <90°±3° | <90°±4° | 30 wafers | 15 wafers |
| Film thickness uniformity(Max-Min)/(2×Ave) | <±2.0% | <±3.0% | <±1.0% | <±2.0% |
| Crucible | φ80mm ×12 pieces | 14 wafers | φ80mm ×20 pieces | |
| Quartz crystal oscillator | 20 (located at center of dome) | 20 (located at center of dome) | ||
| Process chamber pump | 2sets of cryopump and super trap | Four turbo pumps and two cryopumps with super traps |
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| Process chamber base pressure | ＜9.9E-6Pa | ＜9.9E-6Pa | ||