Products
OWLS　Optical wafer level sputtering system

Horizontal metal mode sputter deposition system developed for semiconductor optics.
Supports wafers up to 12 inches in diameter, with capability for simultaneous double-sided deposition and low-temperature deposition.

Features

  • Supports 12-, 10-, 8-, 6-, and 4-inch wafers
  • High-speed, clean substrate transport via vacuum robot
  • Accommodates up to three dual-rotation cylindrical cathodes
  • Achieves low-absorption films using highly reactive plasma sources
  • Optional integration of components such as optical film thickness gauges
  • Compatible with semiconductor process wafer transport modules (EFEM) and SEMI standards
OWLS Optical wafer level sputtering system

Application fields

  • Smartphone（Display）

    Smartphone

  • LED

    LED

Specification

OWLS-1800 OWLS-3000
Vacuum Chamber LL Room TR Room PR Room LL Room PR Room
Substrate Holder 10 pcs(Max 12inch) Maxφ180×L500
Rotary Substrate Drum System φ1800 Turntable type
10rpm～60rpm		 Spindle type
Reaction Source ICP(Inductively coupled plasma)
Sputtering Source Dual rotary cathode
Exhaust System Roughing pump,Turbo molecular pump
Deposition direction Horizontal,Depo-Up,Depo-Down
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