Evaporation system

This device employs an ion beam-assisted deposition method. Ion beam-assisted deposition is a film deposition method that uses an ion gun to bombard the substrate with materials, improving adhesion strength and film quality. The ions emitted by the ion gun have kinetic energy and collide with the film surface of the substrate at high speed. This makes it possible to produce high-quality thin films in terms of density and other characteristics.

Sputtering system

This method involves accelerating ions to bombard a target, ejecting the film material from the target, and then depositing the ejected material onto a substrate. The rotating cylindrical target system allows for stable film deposition with consistent rates and distributions over long periods.

Atomic layer deposition system

This technique allows for the formation of flat, dense thin films by controlling film thickness at the atomic layer level. It enables the coating of uniform films on a wide range of substrates, from flat substrates like Si wafers to three-dimensional structures with high aspect ratios.

Etching system

Dry etching is an essential process for performing microfabrication at the submicron to nanometer scale and is used in the manufacturing processes of various devices. Compared to wet etching, it is superior in nanometer-scale microfabrication and does not require wastewater treatment, resulting in a lower environmental impact and offering advantages as a technology toward SDGs.

Gas cluster trimming system

This technology involves ionizing thousands of gas atoms as clusters, accelerating them, and then using them.
It enables ultra-flattening processes such as surface smoothing and surface modification at the atomic level.